Home > Services
X-Ray Inspection
2 TIPS TO LEARN MORE ABOUT X-RAY INSPECTION FOR BGA
Ball Grid Arrays - array of solder ball connections underneath component, BGA's type have FBGA,
FBGA, PBGA and Extremely Thin Array Packages.
How to Verify a Solder Bond That Cannot Be Observed?
We will use by Electrical test, X-Ray.
How to Verify BGA Soldering Under X-Ray Analysis?
PIC1
PIC1 shows all connections uniformly circular & equal in area - good indication of complete/proper reflow.
PIC2
PIC2 Shows result of errors in component placement.
PIC3
PIC3 shows BGA bridge.
PIC4
PIC4 shows insufficient reflow.
PIC5
PIC5 shows missing balls.
PIC6
PIC6 shows cold soldering.
PIC7
PIC7 shows solder voids, we should control void up to 25% according to IPC Class 2.
Bysco could provide you electrical testing and X-ray for BGA assembly quality.
Services