Item

Craft

NO. LAYER

1-28 layers

FINISHED BOARD SIZE (MAX)

23inch X 41inch (584.2mm X 1041.4mm)

FINISHED BOARD SIZE (MIN)

1inch X 1.2inch(25.4mm X 30.48mm)

BOARD THICKNESS (MAX)

0.236inch (6.0mm)

BOARD THICKNESS (MIN)

0.016inch (0.40mm)

T/C THICKNESS

0.0039inch (0.10mm)

FINISHED BOARD THICKNESS TOLERANCE

(BOARD THICKNESS ≧0.8mm)

+/-10%

FINISHED BOARD THICKNESS TOLERANCE

(0.4mm≦BOARD THICKNESS<0.8mm)

+/-3mils(+/-0.075 mm)

WARPAGE (MAX)

0.5%

DRILLED HOLE DIAMETER (MAX)

6.70mm

DRILLED HOLE DIAMETER (MIN)

0.1mm

FINISHED HOLE DIAMETER (MIN)

0.075mm

OUTER LAYER BASE COPPER THICKNESS

(MIN)

1/3 oz (0.012mm)

OUTER LAYER BASE COPPER THICKNESS

(MAX)

6 oz (0.21mm)

INNER LAYER BASE COPPER THICKNESS

(MIN)

0.5 oz (0.017mm)

INNER LAYER BASE COPPER THICKNESS

(MAX)

6 oz (0.21mm)

INNER LAYER DIELECTRIC THICKNESS

(MIN)

0.0039inch (0.10mm)

DIELECTRIC MATERIAL (MIN)

CEM-3 FR4(130℃ Tg)    

Rogcrs4003

FR4(140℃ Tg)    

FR4(150-170℃ Tg)

HOLE PLATING ASPECT RATIO (MAX)

6 : 1

HOLE DIAMETER TOLERANCE (PTH)

+/-3mils(Batch Process)

HOLE DIAMETER TOLERANCE (NPTH)

+/-2mils(Batch Process)  

+/-1mils(Special Requirement)

OUTER LAYER LINE WIDTH/SPACING (MIN)

T/T oz is 4mil/4mil(T 1/3 oz)
H/H oz is 4mil/5mil
1/1 oz is 6mil/6mil
2/2 oz is 7mil/7mil
2/2 oz is 7mil/7mil

INTER LAYER WIDTH/SPACING (MIN)     

H/H oz is 4mil/4mil

1/1 oz is 4mil/4mil
2/2 oz is 6mil/6mil
3/3 oz is 6mil/6mil

SOLDERMASK THICKNESS (MIN)

10 um

SOLDERMASK PLUG HOLD DIAMETER

≧0.75mm Hole Soft Soldering
0.55mm-0.75mm Single-face Tin Bead
≦0.55mm No Tin Bead

IMPEDANCE TOLERANCE (MIN)

+/-10%

Surface Processing

1. Hot Air Leaving
2. Immersion Gold
3. Deposited Nickel/Gold
4. OSP

THERMAL STRESS TEST

288℃ 10 sec
One Shot

FLAMMABILITY

94V-0

IONIC CONTAMINATION

≦10ug/in2
(≦1.55ug/mm2)