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SMT Assembly
3 Tips to Know More About SMT (Surface Mount Technology) Assembly in China
What's SMT Assembly?
Surface Mount Technology (SMT) Assembly is a process in electronic manufacturing service in which
PCB are produced.
SMT production done by placing the components in direct contact of the surface of PCB/ Printed
Circuit Board.
There are detailed introduce about SMT Assembly Process and THT Assembly Process.
Compared picture for distinguish SMT Assy Production with THT Assembly in the below pictures:
What' SMT Assembly Process?
Bysco's SMT Assembly Process and Galarry in China.
-- New Job BOM Review
Our engineer team will double check customer's Bill of Materials (BOM) before SMT production.
Package type and part number are compared to the customer's assembly drawing.
-- Traveler Planning
Once the BOM is gone through and corrections are made with customer input, our planning dept
creates a process traveler of work instructions to process the job on the production floor and SMT
pre-production machine programming.
-- Kit Audit
At the same time we are planning the job and creating and SMT production file and stencils, our
kit audit team is performing a kit audit of the kit.
Consigned kits require one day of kit audit in advance of turn time. Turnkey jobs require no kit
audit time as we take ownership of that process in advance of turn time.
-- SMTP Setup
SMT line is setup and prepared for SMT assy. Tape and reels are loaded into the machine before SMT
production.
-- Solder Paste
Prior to the addition of the components to a board, solder paste needs to be added to those areas
of the board where solder is required. Typically these areas are the component pads. This is
achieved using a SMT stencil.
We often use best soldering paste like...
-- Screen Printing Process
1. Using the SMT stencil, placed directly onto the board and registered in the correct position.
2. A runner is moved across the screen squeezing a small mount of solder paste through the holes
in the screen and onto the board. As the SMT Stencil has been generated from the printed circuit
board files, it has holes on the positions of the solder pads, and in this way solder is deposited only
on the solder pads.
The amount of solder that is deposited must be controlled to ensure the resulting joints have the
right amount of solder.
-- SMT Pick and Place
Pick and place of components commences. With our high speed pick and place equipment SMT time
is generally no more than half a shift on any given job. Machine times and parts count though can
vary from job to job.
-- Soldering
Once the components have been added to the board, the next stage of the assembly, production
process is to pass it through the soldering machine. Although some boards may be passed through
a wave soldering machine, this process is not widely used for surface mount components these
days.
If wave soldering is used, then solder paste is not added to the board as the solder is provided by
the wave soldering machine. Rather than using wave soldering, reflow soldering techniques are
used more widely.
-- QC
Final inspection for solder joints, miss-alignment of parts or hand loading of connectors and
non-smt parts take place.
· Inspection: After the boards have been passed through the soldering process they are often
inspected. Manual inspection is not an option for surface mount boards employing a hundred
or more components. Instead automatic optical inspection is a far more viable solution. Machines
are available that are able to inspect boards and detect poor joints, misplaced components,
and under some instances the wrong component.
· Test: It is necessary to test electronic products before they leave the factory. There are several
ways in which they may be tested. Further views of test strategies and methods may be found on
the "Test and Measurement" section of this website.
What's SMT Production Capability?
Bysco SMT Assembly Capabilities in China include :
· BGA
· QFN
· SOIC
· TSSOP
· QFP
· FBGA
· COB
· Passive Chip Components (Minimum0201)
· Mixed SMT
· Leaded and lead-free ( RoHS compliant ) assembly process
· Assembly of HDI PCB, multilayer PCBs, also double-sided PCB
· Prototype and pre-production SMT assembly
· ATE and manual functional testing.(test jig to be supplied)
· PIC and EPROM Programming. (hex file to be supplied)
· AOI Inspection
· X-ray Inspection for BGAs
Our engineering staff will review your design and make DFM suggestions as we deem necessary
to reduce cost and increase reliability and manufacturability, but you make the final decision on
any changes.
Bysco will provide quick-turn prototype and production service.
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